It’s late in the evening now because the deeper dives are now wrapping up and I am busier. Before I go to sleep tonight, I am writing an update on the MCA.
While I have been printing the part that would attach to the Arduino, the upper layers do not bond with the lower layers. This is presumably due to temperature differences when the filaments are extruded after resuming the print due to the insertion of the plastic wire.
Working with ABS has been harder than working with PLA. The main benefit of ABS is that the shrinkage allows a wire to be initially inserted into a hole before its size shrinks to prevent removal of the wire. In contrast, PLA does not shrink, resulting in either wires slipping out or being unable to insert wires. However, the shrinkage also reduces the consistency of bonds between layers.
I will upload a longer reflection, with pictures, tomorrow as I complete the presentation.